The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Mar. 21, 2023
SK Hynix Inc., Icheon-si, KR;
Jong Gi Kim, Icheon-si, KR;
Young Jin Noh, Icheon-si, KR;
Jae O Park, Icheon-si, KR;
Jin Ho Bin, Icheon-si, KR;
Dong Chul Yoo, Icheon-si, KR;
Yoo Il Jeon, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A manufacturing method of a semiconductor device may include: forming a stack comprising first material layers and second material layers that are alternately stacked; forming an opening in the stack; forming a first seed layer in the opening; forming a first buffer layer by surface-treating the first seed layer; and forming a blocking layer by oxidizing the first seed layer through the first buffer layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile