The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Jan. 05, 2023
Applicant:
Shennan Circuits Co., Ltd., Shenzhen, CN;
Inventors:
Assignee:
SHENNAN CIRCUITS CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/06 (2006.01); H01F 27/24 (2006.01); H01F 27/32 (2006.01); H01F 41/12 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/183 (2026.01); H05K 1/185 (2026.01); H05K 3/06 (2006.01); H05K 3/14 (2006.01); H05K 3/16 (2006.01); H05K 3/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/143 (2013.01); H01F 27/06 (2013.01); H01F 27/24 (2013.01); H01F 27/324 (2013.01); H01F 41/127 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 3/061 (2013.01); H05K 3/146 (2013.01); H05K 3/16 (2013.01); H05K 3/188 (2013.01); H05K 3/4038 (2013.01); H01F 2027/065 (2013.01); H05K 2201/0183 (2013.01);
Abstract
An inductor assembly and a manufacturing method for an inductor assembly are provided. The inductor assembly includes a circuit board, a magnetic component, and a winding wire. The circuit board defines a groove body, the magnetic component is embedded in the groove body, and the winding wire is arranged on the magnetic component, surrounds along a thickness direction of the magnetic component, and is electrically connected to the circuit board.