The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Feb. 29, 2024
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Jun Sakai, Ogaki, JP;

Kyohei Yoshikawa, Ogaki, JP;

Shunya Hatanaka, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H05K 1/0221 (2013.01); H05K 1/0222 (2013.01); H05K 1/0306 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.


Find Patent Forward Citations

Sakai, Jun. (2026). Printed wiring board (U.S. Patent No. 12568578). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12568578

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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