The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Mar. 01, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Amit Aneja, Chandler, AZ (US);

Rahul Gulati, San Diego, CA (US);

Sriram Hariharan, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G07C 5/08 (2006.01); B60R 16/023 (2006.01); B60W 50/02 (2012.01); G01R 31/00 (2006.01);
U.S. Cl.
CPC ...
G07C 5/0808 (2013.01); G01R 31/007 (2013.01); B60R 16/023 (2013.01); B60W 50/0225 (2013.01);
Abstract

Fail-safe and Fail-operational behavior can be achieved by providing two fully-redundant execution channels comprising at least first and second chiplet dies on a single SoC that are in communication with one another via a D2D interface. At least first and second instances of a first automotive safety integrity level (ASIL) domain circuit disposed on the at least first and second chiplet dies, respectively, perform at least a first ASIL domain process on one or more automotive sensor output signals to produce first and second output signals, respectively. A fault monitoring system monitors at least the first chiplet die for faults and assigns a first value to a selector signal if it detects a fault in the first chiplet die. A selector circuit outputs the second output signal from the system if the selector signal has the first value.


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