The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Feb. 15, 2022
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Bernhard Johannes Brendel, Norderstedt, DE;

Klaus Alfred Erhard, Hamburg, DE;

Claas Bontus, Hamburg, DE;

Artur Sossin, Hamburg, DE;

Axel Thran, Hamburg, DE;

Heiner Daerr, Hamburg, DE;

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 11/00 (2006.01); G06T 5/50 (2006.01); G06T 5/70 (2024.01);
U.S. Cl.
CPC ...
G06T 11/006 (2013.01); G06T 5/50 (2013.01); G06T 5/70 (2024.01); G06T 2211/408 (2013.01);
Abstract

The present invention relates to a method (), resp. a device, system and computer-program product, for material decomposition of spectral imaging projection data. The method comprises receiving () projection data acquired by a spectral imaging system and reducing () noise in the projection data by combining corresponding spectral values for different projection rays to obtain noise-reduced projection data. The method comprises applying () a first projection-domain material decomposition algorithm to the noise-reduced projection data to obtain a first set of material path length estimates, and applying () a second projection-domain material decomposition algorithm to the projection data to obtain a second set of material path length estimates. The second projection-domain material decomposition algorithm comprises an optimization that penalizes a deviation between the second set of material path length estimates being optimized and the first set of material path length estimates.


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