The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Jul. 31, 2023
Qualcomm Incorporated, San Diego, CA (US);
Qualcomm Incorporated, San Diego, CA (US);
Abstract
Methods and apparatuses directed to providing multi-key support within die architectures, such as System-on-a-Chips. In some examples, a die package includes key activation fuses, key revocation fuses, and key fuses for multiple keys. The die package also includes a processor electrically coupled to the key activation fuses, the key revocation fuses, and the plurality of key fuses. Further, the processor can generate a first key value and write the first key value to the key fuses to generate a first key. The processor can also write to the key activation fuses to activate the first key. The processor can further provision the first key to a first memory device. When the first memory device is replaced with a second memory device, the processor can write to the key revocation fuses to revoke the first key, and can provision a second key to the second memory device.