The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Mar. 25, 2024
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Hyungseuk Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/44 (2013.01); G06F 21/60 (2013.01); G06F 21/71 (2013.01); H04L 9/32 (2006.01);
U.S. Cl.
CPC ...
G06F 21/445 (2013.01); G06F 21/602 (2013.01); G06F 21/71 (2013.01); H04L 9/3268 (2013.01);
Abstract
A method of manufacturing a multi-chip includes generating a first authentication certificate in a first die using a private key of the first die, verifying the first authentication certificate in a second die using a public key of the first die, generating a second authentication certificate in the second die using a private key of the second die, and verifying the second authentication certificate using a public key of the second die in a third die.
Quick Actions:
Kim, Hyungseuk. (2026). Multi-chip for performing chiplet security authentication and method of manufacturing the same (U.S. Patent No. 12566837). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12566837
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile