The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
May. 29, 2024
Lapis Technology Co., Ltd., Yokohama, JP;
Takuya Matsumoto, Yokohama, JP;
LAPIS Technology Co., Ltd., Yokohama, JP;
Abstract
A semiconductor device is formed by first and second dies manufactured by processes with different wiring widths and includes: a first switch, outputting an input power voltage when set to ON, and stopping output when set to OFF; and a second switch, outputting, from a second voltage output terminal, the power voltage output to a second voltage input terminal when set to ON and stopping output when set OFF; and at least one retention flip-flop, provided with: a first power terminal, connected with the second voltage output terminal; and a second power terminal, connected with the first voltage output terminal, and maintaining data when the power voltage is supplied to the second power terminal and supply of the power voltage to the first power terminal is cut off. The first switch is formed in a first die, and the second switch and retention flip-flop are formed in a second die.