The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Aug. 31, 2023
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Ming-Cheng Lo, New Taipei, TW;

Jui-Chun Chang, Hsinchu, TW;

Shih-Chang Huang, Hsinchu, TW;

Wu-Hsi Lu, Hsinchu, TW;

Yu-Che Tsai, Hsinchu, TW;

Shih-Hao Liu, Taoyuan, TW;

Yen-Shih Ho, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/136 (2006.01); G02B 6/132 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/136 (2013.01); G02B 6/132 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12104 (2013.01); G02B 2006/12147 (2013.01);
Abstract

A photonic integrated circuit structure includes a semiconductor substrate. A waveguide is disposed above the semiconductor substrate and has an inclined plane. A mirror coating layer is conformally disposed on the inclined plane. A cladding layer covers the waveguide and the mirror coating layer. A hole is disposed in the semiconductor substrate or the cladding layer, and the hole overlaps the inclined plane in a vertical direction. In addition, an optical fiber is disposed in the hole to receive a reflected light from the mirror coating layer.


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