The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Jul. 01, 2022
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Karl Oberdieck, Neckartenzlingen, DE;
Manuel Riefer, Reutlingen, DE;
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 29/11 (2006.01); G01H 1/00 (2006.01); G01N 29/44 (2006.01); G01N 29/48 (2006.01);
U.S. Cl.
CPC ...
G01N 29/11 (2013.01); G01N 29/4436 (2013.01); G01H 1/00 (2013.01); G01N 29/48 (2013.01); G01N 2291/0258 (2013.01); G01N 2291/2697 (2013.01);
Abstract
A power semiconductor device. The power semiconductor device includes a heat sink and three half-bridge modules, which are each arranged on the heat sink by way of a connecting region. The power semiconductor device includes at least one ultrasonic sensor and at least one MEMS sensor, wherein the at least one ultrasonic sensor and the at least one MEMS sensor are arranged on opposite sides of the heat sink.