The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Jun. 11, 2021
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Wintec, Inc., Koka, JP;

Inventors:

Hideaki Saito, Osaka, JP;

Shigenori Homma, Osaka, JP;

Jun Sugawara, Koka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 75/23 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 65/40 (2006.01); C08J 9/42 (2006.01); H01B 3/30 (2006.01); H01F 5/06 (2006.01);
U.S. Cl.
CPC ...
C08G 75/23 (2013.01); C08G 59/245 (2013.01); C08G 59/4021 (2013.01); C08G 65/4056 (2013.01); C08J 9/42 (2013.01); H01B 3/30 (2013.01); H01F 5/06 (2013.01); C08J 2203/22 (2013.01); C08J 2363/02 (2013.01); C08J 2381/06 (2013.01);
Abstract

A resin composition includes a phenoxy resin as a principal component. The phenoxy resin has a weight-average molecular weight of 40,000 or more. The phenoxy resin has, in the same or different molecules, a first structural unit derived from bisphenol S phenoxy and a second structural unit derived from a bisphenol epoxy other than the first structural unit. A content ratio of the first structural unit in the phenoxy resin is 20 mol % to 80 mol % relative to a total content of the first structural unit and the second structural unit constituting the phenoxy resin.


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