The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Feb. 27, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Joseph Yehle, Dallas, TX (US);

Roy Deidrick Solomon, Melissa, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/08 (2014.01); B23K 26/0622 (2014.01); B23K 26/38 (2014.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01); H01L 21/67 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/0622 (2015.10); B23K 26/0869 (2013.01); H01L 21/67092 (2013.01); H01L 21/76894 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08);
Abstract

A method of fabricating an electronic component includes: controlling a laser cutting tool at a first pulse rate to form a first cut portion in a feature of the electronic component, the feature having opposite first and second sides spaced apart from one another along a first direction, and third and fourth sides spaced apart from one another along a second direction, the first cut portion extending from the third side toward the fourth side; controlling the laser cutting tool at a higher second pulse rate and to form a second cut portion extending from the first cut portion toward the fourth side; and controlling the laser cutting tool at a third pulse rate to form a final cut portion extending from the second cut portion toward the fourth side, the third pulse rate less than the second pulse rate.


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