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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12564880 B1

PDFFull Text
Date of Patent:
Mar. 03, 2026

Filed:

Jan. 06, 2021

Method for producing sputtering target material

Applicant:

Sanyo Special Steel Co., Ltd., Himeji, JP;

Inventor:

Noriaki Matsubara, Himeji, JP;

Assignee:

Sanyo Special Steel Co., Ltd., Himeji, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Alexandra M Moore

Int. Cl.
CPC ...
B22F 1/00 (2022.01); C22C 1/04 (2023.01); C22C 19/07 (2006.01); C22C 30/00 (2006.01); C22C 38/00 (2006.01); C22C 38/10 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); B22F 3/10 (2006.01);
U.S. Cl.
CPC ...
B22F 1/09 (2022.01); B22F 1/00 (2013.01); C22C 1/0433 (2013.01); C22C 19/07 (2013.01); C22C 30/00 (2013.01); C22C 38/002 (2013.01); C22C 38/10 (2013.01); C23C 14/14 (2013.01); C23C 14/3414 (2013.01); B22F 3/10 (2013.01);
Abstract

Provided is a method of producing a target material with reduced particle generation during sputtering, which is a method of producing a sputtering target material whose material is an alloy M, including a sintering step of sintering a mixed powder obtained by mixing a first powder and a second powder. A material of the first powder is an alloy M1 in which the proportion of a B content is from 40 at. % to 60 at. %. A material of the second powder is an alloy M2 in which the proportion of a B content is from 20 at. % to 35 at. %. The proportion of a B content in the mixed powder is from 33 at. % to 50 at. %. A metallographic structure including a (CoFe)B phase and a (CoFe)B phase is formed in the sintering step. A boundary length per unit area Y (1/μm), which is obtained by measuring a boundary length between the (CoFe)B phase and the (CoFe)B phase using a scanning electron microscope, and a proportion X (at. %) of a B content of the alloy M satisfy the expression<−0.0015×(−42.5)+0.15.

Find Patent Forward Citations

Matsubara, Noriaki. (2026). Method for producing sputtering target material (U.S. Patent No. 12564880). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564880

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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