The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Apr. 13, 2021
Nippon Light Metal Company, Ltd., Tokyo, JP;
Toyo Aluminium Kabushiki Kaisha, Osaka, JP;
Masato Yatsukura, Tokyo, JP;
Takashi Nagao, Shizuoka, JP;
Tsuguharu Tashiro, Shizuoka, JP;
Jun Kusui, Osaka, JP;
NIPPON LIGHT METAL COMPANY, LTD., Tokyo, JP;
TOYO ALUMINIUM KABUSHIKI KAISHA, Osaka, JP;
Abstract
The present invention provides an aluminum molded body having high thermal conductivity as well as higher strength than a rolled material, and a method for producing the aluminum molded body. More specifically, provided are an aluminum molded body having a thermal conductivity of 180 W/mK or higher and higher strength than a rolled material of the same composition, and a method with which it is possible to efficiently produce the aluminum molded body even when the shape thereof is complex. An aluminum layered molded body obtained by molding through an additive manufacturing method according to the present invention is characterized in that: an aluminum material containing 0.001-2.5 mass % of a transition metal element that forms a eutectic with Al, the balance being Al and unavoidable impurities, is used as a raw material; and the thermal conductivity is 180 W/mK or higher.