The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Nov. 29, 2022
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Kazuhisa Mori, Tokyo, JP;

Toshiyuki Hata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H02J 7/00 (2006.01); H03K 17/687 (2006.01); H10D 12/00 (2025.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/17 (2025.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/074 (2013.01); H01L 25/07 (2013.01); H02J 7/0063 (2013.01); H03K 17/6871 (2013.01); H10D 12/481 (2025.01); H10D 30/668 (2025.01); H10D 62/127 (2025.01); H10D 62/393 (2025.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/182 (2013.01);
Abstract

Performance of a semiconductor device is enhanced. A loss of a circuit device using a semiconductor device as a switch is reduced. A semiconductor device includes: a first semiconductor chip having a first MOSFET of p-type and a first parasitic diode; and a second semiconductor chip having a second MOSFET of n-type and a second parasitic diode. On front surfaces of the first and second semiconductor chips, a first source electrode and a first gate wiring and a second source electrode and a second gate wiring are formed, respectively. On back surfaces of the first and second semiconductor chips, first and second drain electrodes are formed, respectively. The second back surface and the first front surface face each other such that the second drain electrode and the first source electrode come into contact with each other via a conductive paste.


Find Patent Forward Citations

Mori, Kazuhisa. (2026). Semiconductor device and circuit device (U.S. Patent No. 12564100). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564100

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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