The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Mar. 15, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Johannes Uhlig, Soest, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/60 (2013.01);
Abstract
A power semiconductor package includes a substrate, a power semiconductor chip arranged on the substrate, and an encapsulant encapsulating the power semiconductor chip. The encapsulant includes a voltage stabilizing additive. The voltage stabilizing additive is configured to minimize or eliminate partial discharges within the encapsulant.
Uhlig, Johannes. (2026). Power semiconductor package having a voltage stabilizing additive and method for fabricating the power semiconductor package (U.S. Patent No. 12564092). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564092
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile