The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Aug. 01, 2023
Applicant:

Zf Friedrichshafen Ag, Friedrichshafen, DE;

Inventors:

Ake Ewald, Bayreuth, DE;

Stefan Hain, Speichersdorf, DE;

Assignee:

ZF Friedrichshafen AG, Friedrichshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 25/072 (2013.01);
Abstract

A power electronics module, having a PCB having power semiconductors arranged on connecting regions of an uppermost layer of said PCB, wherein the PCB has a preset dimension to arrange a preset maximum number of power semiconductors thereon. A lead frame arranged above the power semiconductors provides three-dimensional power and control routing, and includes a drain-source connection to connect to a drain-source contact of the PCB, and a load-source connection opposite the drain-source connection via the power semiconductors that is formed from a plurality of subregions, each of which can be brought into electrical contact with the power semiconductors, and a gate- and kelvin-source terminal, which are arranged above the load-source connection and have been brought into electrical contact with the power semiconductors. At least one dummy chip consisting of an electrically nonconductive material is arranged on each of the connecting regions that are not populated by power semiconductors.


Find Patent Forward Citations

Ewald, Ake. (2026). Power electronics module (U.S. Patent No. 12564074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564074

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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