The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Aug. 02, 2023
Jcet Stats Chippac Korea Limited, Incheon, KR;
Eunbyeol Lee, Incheon, KR;
Doosoub Shin, Incheon, KR;
Yejin Park, Incheon, KR;
Hyukcheon Kwon, Gyeonggi-do, KR;
Abstract
Provided is a method for forming a partial shielding for an electronic assembly, comprising: providing an electronic assembly mounted on a mother board, wherein the electronic assembly comprises a substrate, and at least one electronic component and a conductive pattern mounted on a top surface of the substrate; disposing a mask onto the substrate to cover the at least one electronic component; forming an encapsulant layer on the mother board to encapsulate at least the electronic assembly; forming a trench through the encapsulant layer to expose at least a portion of the conductive pattern and at least a portion of lateral surfaces of the mask; forming a shielding layer on the mother board to cover the encapsulant layer and fill in the trench; and detaching the mask from the mother board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile