The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Oct. 09, 2019
Dupont Electronics, Inc., Wilmington, DE (US);
Christopher Robert Becks, Grove City, OH (US);
Rosa Irene Gonzalez, Circleville, OH (US);
Thomas D Lantzer, Wake Forest, NC (US);
Rajesh Tripathi, Wilmington, DE (US);
Abstract
A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 μm, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 μm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile