The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Oct. 21, 2022
Applicant:

Kookmin University Industry Academy Cooperation Foundation, Seoul, KR;

Inventor:

Young Rag Do, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 25/075 (2006.01); H10H 20/84 (2025.01); H10H 20/01 (2025.01); H10H 20/819 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H10H 20/84 (2025.01); H01L 2221/68381 (2013.01); H10H 20/018 (2025.01); H10H 20/819 (2025.01);
Abstract

The present invention relates to an ultra-thin light-emitting diode (LED) electrode assembly, a manufacturing method of the ultra-thin LED electrode assembly, and a transfer film of an ultra-thin LED used for manufacturing the ultra-thin LED electrode assembly and relates to an ultra-thin LED electrode assembly in which a plurality of LED elements are simultaneously transferred using a laser-assisted multi-chip transfer printing method to form and pattern the LED elements, thereby preventing process defects caused by omission of the LED elements during transfer and deviation thereof from an electrode line, and defects such as dark spots caused in an LED display, a manufacturing method of the ultra-thin LED electrode assembly, and a transfer film of an ultra-thin LED used for manufacturing the ultra-thin LED electrode assembly.


Find Patent Forward Citations

Do, Young. (2026). Ultra-thin transfer film of ultra-thin led element for manufacturing ultra-thin led electrode assembly using laser-assisted multi-chip transfer printing, ultra-thin led electrode assembly, and manufacturing method thereof (U.S. Patent No. 12564005). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564005

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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