logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12563945 B1

PDFFull Text
Date of Patent:
Feb. 24, 2026

Filed:

May. 19, 2021

Display substrates and their manufacturing methods, and display devices

Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yunhao Wang, Beijing, CN;

Peng Hou, Beijing, CN;

Yongzhan Han, Beijing, CN;

Yuan He, Beijing, CN;

Can Huang, Beijing, CN;

Zhen Li, Beijing, CN;

Yulin Wang, Beijing, CN;

Jiandong Bao, Beijing, CN;

Pengcheng Zhao, Beijing, CN;

Yide Du, Beijing, CN;

Assignees:

Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan, CN;

BOE Technology Group Co., Ltd., Beijing, CN;

Attorney:

IPro, PLLC

Primary Examiner:

Ajay Ojha

Assistant Examiner:

Hajer undefined Kolahdouzan

Int. Cl.
CPC ...
H10K 59/80 (2023.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 59/126 (2023.01); H10K 59/35 (2023.01); H10K 59/38 (2023.01);
U.S. Cl.
CPC ...
H10K 59/873 (2023.02); H10K 59/1201 (2023.02); H10K 59/122 (2023.02); H10K 59/126 (2023.02); H10K 59/352 (2023.02); H10K 59/353 (2023.02); H10K 59/38 (2023.02); H10K 59/8792 (2023.02); H10K 59/8731 (2023.02);
Abstract

The present application provides display substrates and their manufacturing methods, and display devices. A display substrate includes a base substrate, an encapsulation layer, a filter layer and optical film layers. The encapsulation layer is located on the base substrate. The filter layer is located in the encapsulation layer. The filter layer includes black matrixes. The black matrixes include black matrix openings. The optical film layers are located on a side of the encapsulation layer away from the base substrate. The optical film layers are configured to transmit part of incident light and absorb part of the incident light. A light transmittance of the optical film layers is larger than that of the black matrixes. The optical film layers include optical film layer openings. Projections of the optical film layer openings on the base substrate are located within projections of the black matrix openings on the base substrate.

Find Patent Forward Citations

Loading…