The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Apr. 25, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chung-Chia Chen, San Jose, CA (US);

Ji Young Choung, Hwaseong-si, KR;

Dieter Haas, San Jose, CA (US);

Yu-Hsin Lin, Zhubei, TW;

Jungmin Lee, Santa Clara, CA (US);

Wen-Hao Wu, San Jose, CA (US);

Si Kyoung Kim, Gwangju-si, KR;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/122 (2023.01); H10K 59/173 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
H10K 59/122 (2023.02); H10K 59/173 (2023.02); H10K 59/873 (2023.02);
Abstract

Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.


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