The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Dec. 29, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jiayu He, Beijing, CN;

Yan Qu, Beijing, CN;

Ce Ning, Beijing, CN;

Zhengliang Li, Beijing, CN;

Hehe Hu, Beijing, CN;

Jie Huang, Beijing, CN;

Nianqi Yao, Beijing, CN;

Kun Zhao, Beijing, CN;

Feifei Li, Beijing, CN;

Qi Qi, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01);
Abstract

A wiring board includes a substrate, conductive pads and at least one protective layer group. The conductive pads are disposed on the substrate. The at least one protective layer group is disposed on a side of the conductive pads away from the substrate; a protective layer group includes an oxidation protective layer and a palladium alloy layer that are stacked, and the oxidation protective layer is closer to the substrate than the palladium alloy layer. A material of the oxidation protective layer includes a nickel-based alloy.


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