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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12563839 B1

PDFFull Text
Date of Patent:
Feb. 24, 2026

Filed:

Jun. 30, 2021

Integrated rc architecture, and methods of fabrication thereof

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Stéphane Bouvier, Cairon, FR;

Larry Buffle, Caen, FR;

Sophie Gaborieau, Sainte Honorine du Fay, FR;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;

Attorney:

ArentFox Schiff LLP

Primary Examiner:

Jarrett J Stark

Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 21/70 (2006.01); H03H 1/02 (2006.01); H03H 3/00 (2006.01); H10D 1/00 (2025.01); H10D 1/47 (2025.01); H10D 1/68 (2025.01); H10D 86/85 (2025.01);
U.S. Cl.
CPC ...
H10D 86/85 (2025.01); H01L 21/707 (2013.01); H03H 1/02 (2013.01); H03H 3/00 (2013.01); H10D 1/042 (2025.01); H10D 1/47 (2025.01); H10D 1/716 (2025.01);
Abstract

RC architectures are provided that include a substrate provided with a capacitor having a thin-film top electrode portion at a surface of the substrate on one side thereof. The resistance provided in series with the capacitor is controlled by providing a contact plate, spaced from the thin-film top electrode portion, and a set of plural bridging contacts extending between, and electrically interconnecting, the thin-film top electrode portion and the contact plate. Different resistance values can be set by appropriate selection of the number of bridging contacts. The capacitor can be a three-dimensional capacitor and contacts are then provided on respective first and second sides of the substrate, which face each other in the thickness direction of the substrate.

Find Patent Forward Citations

Bouvier, Stéphane. (2026). Integrated rc architecture, and methods of fabrication thereof (U.S. Patent No. 12563839). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12563839

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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