The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Mar. 15, 2023
Hewlett Packard Enterprise Development Lp, Spring, TX (US);
Jinsung Youn, Milpitas, CA (US);
Xia Sheng, Milpitas, CA (US);
James Ignowski, Ft. Collins, CO (US);
Darrin Miller, Ft. Collins, CO (US);
Catherine Graves, Milpitas, CA (US);
Hewlett Packard Enterprise Development LP, Spring, TX (US);
Abstract
Examples of the present technology provide heterogeneous (i.e., multi-chip) ASIC-memristor integrations that enable high voltage-dependent precision memristor programming while preserving optimal ASIC performance/capabilities. Examples achieve these advantages by 'de-coupling' memristor hardware from ASIC chip. Accordingly, a heterogeneous ASIC-memristor integration of the present technology may comprise an ASIC chip packaged onto a functional “memristor-interposer” chip. The memristor interposer may serve both a functional and structural purpose. Namely, memristors of the memristor interposer can be leveraged in conjunction with the ASIC for processing/computation functions—while connections within the memristor interposer route signals between ASIC and computing system (e.g., between the ASIC and a printed circuit board).