The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Jul. 06, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Byeongkeol Kim, Suwon-si, KR;

Eunseok Hong, Suwon-si, KR;

Youngsun Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H04B 1/00 (2006.01); H04M 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H04B 1/0053 (2013.01); H04M 1/0277 (2013.01); H05K 1/028 (2013.01); H05K 1/118 (2013.01); H05K 3/28 (2013.01); H05K 3/429 (2013.01); H05K 2201/09636 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay.


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