The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Sep. 24, 2021
Applicant:

Suncall Corporation, Kyoto, JP;

Inventors:

Shota Tatsumi, Kyoto, JP;

Yuusuke Adachi, Kyoto, JP;

Assignee:

Suncall Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 5/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/852 (2025.01);
U.S. Cl.
CPC ...
H02G 5/005 (2013.01); H01L 21/481 (2013.01); H01L 21/4871 (2013.01); H02G 5/007 (2013.01); H01L 23/49894 (2013.01); H01L 25/0753 (2013.01); H10H 20/0362 (2025.01); H10H 20/852 (2025.01);
Abstract

According to a manufacturing method of the present invention, it is possible to manufacture a busbar assembly in an efficient manner, the busbar assembly including busbars disposed in parallel in a common plane and an insulative resin layer including a gap filling portion filled into a gap between the adjacent busbars and a bottom-surface-side laminated portion extending integrally from the gap filling portion and arranged on bottom surfaces of the busbars, a top surface of the busbar being at least partially exposed to form a top-surface-side connection portion, the bottom surface of the busbar including a first bottom surface region which is located at the same position in a thickness direction as a lower end portion of the gap and on which the bottom-surface-side laminated portion is arranged and a second bottom surface region located farther away from the top surface than the first bottom surface region and exposed to the outside to form a bottom-surface-side connection portion.


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