The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Oct. 05, 2023
Applicant:

Mektec Corporation, Tokyo, JP;

Inventors:

Shuzo Yamada, Tokyo, JP;

Kenichi Nakayama, Tokyo, JP;

Tomoki Kanayama, Tokyo, JP;

Assignee:

MEKTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 12/61 (2011.01);
U.S. Cl.
CPC ...
H01R 12/61 (2013.01); H05K 1/118 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09781 (2013.01);
Abstract

Provided is a flexible printed circuit connection structure which includes a flexible printed circuit having a plurality of wires, a board to be connected having a plurality of wires to be connected, a plurality of solder connection portions, and a partition wall, in which: the plurality of solder connection portions is a part where the plurality of wires of the flexible printed circuit and the plurality of wires to be connected of the board to be connected are connected to each other by solder; the partition wall is provided away from the plurality of solder connection portions so as to surround the plurality of solder connection portions; and the flexible printed circuit, the board to be connected, and the partition wall define a sealed space, and the plurality of solder connection portions is arranged inside the sealed space.


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