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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12562335 B1

PDFFull Text
Date of Patent:
Feb. 24, 2026

Filed:

Apr. 13, 2021

Sample inspection apparatus, inspection system, thin piece sample fabrication apparatus, and method for inspecting sample

Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Masahiro Yoshida, Tokyo, JP;

Junichi Fuse, Tokyo, JP;

Norio Sato, Tokyo, JP;

Hirotsugu Kajiyama, Tokyo, JP;

Assignee:

Hitachi High-Tech Corporation, Tokyo, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Nicole M Ippolito

Int. Cl.
CPC ...
H01J 37/20 (2006.01); H01J 37/22 (2006.01); H01J 37/24 (2006.01); H01J 37/244 (2006.01); H01J 37/26 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
H01J 37/20 (2013.01); H01J 37/222 (2013.01); H01J 37/244 (2013.01); H01J 37/265 (2013.01); H01J 37/28 (2013.01); H01J 2237/2448 (2013.01); H01J 2237/24564 (2013.01); H01J 2237/24592 (2013.01); H01J 2237/2817 (2013.01);
Abstract

A sample inspection apparatus is provided. The invention is directed to a sample inspection apparatusthat includes an inspection means that is executed when a sampleis placed on a stage, the inspection means including the steps of (a) scanning a surface of the samplewith an electron beam EBwith a probein contact with a conductorand a probein contact with a conductor, (b) measuring a differential value of a change in potential difference between the probesandwhile synchronizing with the scanning of the electron beam EB, (c) acquiring a DI-EBAC image in which a fault spotexisting between the conductorsandis shown as a bright part and a dark part based on the differential value of the change in the potential difference, and (d) specifying a direction of the fault spotfrom the DI-EBAC image.

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Yoshida, Masahiro. (2026). Sample inspection apparatus, inspection system, thin piece sample fabrication apparatus, and method for inspecting sample (U.S. Patent No. 12562335). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12562335

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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