The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Apr. 20, 2023
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Wei Wang, Singapore, SG;

Chin Tong Thia, Singapore, SG;

Yidan Chen, Singapore, SG;

Assignee:

OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/10 (2006.01);
U.S. Cl.
CPC ...
G06F 13/10 (2013.01); G06F 2213/40 (2013.01);
Abstract

A computing device is provided. The computing device includes a system-on-chip (SoC) device, and the SoC device includes a plurality of master devices and a stacked memory. The master devices are arranged on a die. The master devices are grouped in space into a plurality of logic device clusters with a clustering scheme defined according to operating requirements of the master devices. The stacked memory is disposed above the die. Connections between the stacked memory and the plurality of logic device clusters are established according to the clustering scheme defined.


Find Patent Forward Citations

Wang, Wei. (2026). Interconnection clustering architecture in system-on-chip and method for facilitating data accessing and data transfer operations using the same (U.S. Patent No. 12561257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12561257

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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