The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Aug. 10, 2022
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Alan Kleiman-Shwarsctein, Santa Clara, CA (US);

Alexander Feldman, Los Altos, CA (US);

Adar Magen, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/00 (2006.01); C03B 23/22 (2006.01); C03C 17/22 (2006.01); C03C 17/23 (2006.01); C03C 27/06 (2006.01); C23C 14/04 (2006.01); C23C 14/58 (2006.01); C23C 16/04 (2006.01); C23C 16/56 (2006.01); G02B 1/10 (2015.01); G02B 5/04 (2006.01);
U.S. Cl.
CPC ...
G02B 5/003 (2013.01); C03B 23/22 (2013.01); C03C 17/22 (2013.01); C03C 17/23 (2013.01); C03C 27/06 (2013.01); C23C 14/042 (2013.01); C23C 14/5886 (2013.01); C23C 16/042 (2013.01); C23C 16/56 (2013.01); G02B 5/04 (2013.01); C03C 2218/119 (2013.01); C03C 2218/152 (2013.01); C03C 2218/154 (2013.01); G02B 1/10 (2013.01);
Abstract

A glass optical component with embedded mask may be formed from multiple, discrete glass member components using a non-adhesive bonding process. A black mask may be created at a surface of a first member component using a deposition or a printing-and-sintering process. A backfill coating may then be applied to and then polished at the surface of the first member component. Next, the first member component may be bonded with a second member component, with the non-adhesive bonding process, at the surface of the first member component to form the optical component with the black mask embedded between the first and second member components. In addition, the glass optical component forming process may be implemented on a glass wafer level to make multiple glass optical components at a same time.


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