The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Jul. 29, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Rand Haddadin, Gilbert, AZ (US);
Kunal Bhatnagar, Chandler, AZ (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); C23C 16/08 (2006.01); C23C 16/56 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
C23C 16/045 (2013.01); C23C 16/08 (2013.01); C23C 16/56 (2013.01); H10B 12/02 (2023.02);
Abstract
Embodiments of the disclosure relate to methods for molybdenum gapfill. Additional embodiments provide a method of forming a molybdenum gapfill without substantial voids. Some embodiments of the disclosure are relevant for higher aspect ratio features including DRAM memory cells.
Haddadin, Rand. (2026). Bottom up molybdenum gapfill (U.S. Patent No. 12559836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12559836
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile