The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Nov. 17, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Chang Hwan Kim, Suwon-si, KR;
Takafumi Noguchi, Yokohama, JP;
Toshihiro Iizuka, Yokohama, JP;
Kenichi Nagayama, Yokohama, JP;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 1/26 (2006.01); B28B 3/02 (2006.01); B28B 11/24 (2006.01); C01F 17/259 (2020.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C01F 17/259 (2020.01); B28B 1/26 (2013.01); B28B 3/02 (2013.01); B28B 11/243 (2013.01); H01J 37/32495 (2013.01); C01P 2006/62 (2013.01); C01P 2006/80 (2013.01); C01P 2006/90 (2013.01);
Abstract
A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more of YOF, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.
Kim, Chang. (2026). Sintered body, method of fabricating the same, semiconductor fabricating device, and method of fabricating semiconductor fabricating device (U.S. Patent No. 12559381). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12559381
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile