The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Sep. 24, 2021
Applicants:
Toray Industries, Inc., Tokyo, JP;
Du Pont-toray Co., Ltd., Tokyo, JP;
Inventors:
Hideto Mitsuoka, Nagoya, JP;
Hiroshi Kiyama, Nagoya, JP;
Yukitane Kimoto, Nagoya, JP;
Hideaki Machida, Tokyo, JP;
Masakazu Okui, Tokai, JP;
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); B29C 70/30 (2006.01); B29C 70/88 (2006.01); B32B 27/12 (2006.01); B32B 27/28 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B29C 70/30 (2013.01); B29C 70/88 (2013.01); B32B 27/12 (2013.01); B32B 27/281 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2307/302 (2013.01); B32B 2605/00 (2013.01);
Abstract
A molding base material has at least a fiber-reinforced resin prepreg layer, a fiber paper layer, and a partition layer interposed between the prepreg layer and the fiber paper layer; a molded product obtained using the same; and a production method therefor. The resulting product makes it possible to achieve high thermal resistance and heat insulation as well as improved overall space efficiency and weight reduction in a fiber-reinforced resin molded product.