The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Sep. 24, 2021
Toray Industries, Inc., Tokyo, JP;
Du Pont-toray Co., Ltd., Tokyo, JP;
Hideto Mitsuoka, Nagoya, JP;
Hiroshi Kiyama, Nagoya, JP;
Yukitane Kimoto, Nagoya, JP;
Hideaki Machida, Tokyo, JP;
Masakazu Okui, Tokai, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A molding base material has at least a fiber-reinforced resin prepreg layer, a fiber paper layer, and a partition layer interposed between the prepreg layer and the fiber paper layer; a molded product obtained using the same; and a production method therefor. The resulting product makes it possible to achieve high thermal resistance and heat insulation as well as improved overall space efficiency and weight reduction in a fiber-reinforced resin molded product.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile