The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Dec. 21, 2021
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Miho Onodera, Ehime, JP;

Yoshiki Takebe, Ehime, JP;

Yuta Naito, Ehime, JP;

Jun Misumi, Ehime, JP;

Yoshifumi Nakayama, Ehime, JP;

Masato Honma, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/10 (2006.01); B29B 11/16 (2006.01); B32B 27/08 (2006.01); C08J 5/24 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
B29B 11/16 (2013.01); B32B 5/10 (2013.01); C08J 5/243 (2021.05); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0881 (2013.01); C08J 2363/02 (2013.01); C08J 2423/30 (2013.01); C08J 2471/10 (2013.01); C08J 2477/02 (2013.01); C08J 2481/06 (2013.01);
Abstract

A problem to be solved by the present invention is to provide a prepreg and an integrally molded article, wherein the prepreg exhibits suitable flexibility and adhesiveness, excels in formability on a complicated mold face and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position. A main object of the present invention is to provide a prepreg including (A) reinforcing fibers, (B) a thermosetting resin, and (C) a thermoplastic resin, wherein the (C) thermoplastic resin exists in at least a part of a face of the prepreg, and wherein the prepreg satisfies the condition [I], and satisfies the condition [II] or the condition [III]: [I]: the (B) thermosetting resin has a peak in the temperature range of more than 100° C. and 180° C. or less on a loss tangent (tan δ) curve measured under isokinetic heating by dynamic mechanical analysis (DMA); [II]: on a loss angle δ curve obtained by measuring the prepreg isothermally by dynamic mechanical analysis (DMA), the loss angle δ curve has a point representing the maximum value, and has a point which represents a loss angle δ value 5° or more smaller than the maximum value, and which is on the earlier time side of the point representing the maximum value; and [III]: even if, on the loss angle δ curve obtained by measuring the prepreg isothermally by dynamic mechanical analysis (DMA), the loss angle δ curve has a point representing the maximum value, the loss angle δ curve does not have a point which represents a loss angle δ value 5° or more smaller than the maximum value, and which is on the earlier time side of the point representing the maximum value, or the loss angle δ curve does not have a point representing the maximum value, and has a descendingly behaving section in which the loss angle δ value becomes 5° or more smaller at a slope of −1.4°/minute or more.


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