The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Dec. 23, 2021
Applicant:

Fujifilm Sonosite, Inc.;

Inventors:

Wei Li, Bothell, WA (US);

Jimin Zhang, Bothell, WA (US);

Assignee:

FUJIFILM SONOSITE, INC., Bothell, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); H10N 30/088 (2023.01);
U.S. Cl.
CPC ...
B06B 1/0622 (2013.01); B06B 1/067 (2013.01); H10N 30/088 (2023.02);
Abstract

A method of fabricating a transducer includes embedding signal flexes and ground-return flexes inside a backing block. The method includes forming stack configurations with a height in elevation and a width perpendicular to the height. The forming includes: dicing a piezoelectric layer in the elevation into rows (separating the piezoelectric layer into portions); defining a beam pattern for the transducer by aligning the portions on the backing block; and forming gaps in-between each piezoelectric layer portion and each adjacently aligned piezoelectric layer portion. The method includes forming stacks by bonding one or more matching layers to the piezoelectric layer portions by utilizing a conductive surface of a first matching layer of the one or more matching layers. The method also includes forming cavities in the one or more matching layers in elevation, dicing the stacks along an elevation direction into multiple elements, and filling the cavities with a material.


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