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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12557713 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Oct. 27, 2021

Intelligent power module and manufacturing method thereof

Applicants:

Edgeless Semiconductor Co., Ltd. of Zhuhai, Zhuhai, CN;

Gree Electric Appliances, Inc. of Zhuhai, Zhuhai, CN;

Inventors:

Wei Jiang, Zhuhai, CN;

Bo Shi, Zhuhai, CN;

Dan Zeng, Zhuhai, CN;

Jun Cao, Zhuhai, CN;

Yongbo Liao, Zhuhai, CN;

Ting Xiao, Zhuhai, CN;

Assignees:

EDGELESS SEMICONDUCTOR CO., LTD. OF ZHUHAI, Zhuhai, CN;

GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI, Zhuhai, CN;

Attorney:

Armstrong Teasdale LLP

Primary Examiner:

Sonya Mccall-Shepard

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01);
Abstract

Disclosed are an intelligent power module and a manufacturing method thereof, which relate to the technical field of electronic devices. The intelligent power module includes a substrate, wherein a chip and a plurality of conductive pins are arranged on the substrate, one end of each of the conductive pins is connected to the chip, and a solder pin is formed at an end portion of the other end of the conductive pin; and an external pin frame, including a plurality of leads, and a connection structure is formed at an end portion of one end of each of the lead; and the connection structure includes a connection portion, and support portions, wherein an arrangement direction of the support portions is the same as that of the solder pins, an accommodation space is formed between the two support portions, and the solder pin is located between the two support portions.

Find Patent Forward Citations

Jiang, Wei. (2026). Intelligent power module and manufacturing method thereof (U.S. Patent No. 12557713). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12557713

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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