The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
May. 22, 2023
Yenrich Technology Corporation, Hsinchu, TW;
Epistar Corporation, Hsinchu, TW;
Li-Yuan Huang, Hsinchu, TW;
Tzu-Hsiang Wang, Hsinchu, TW;
Chi-Chih Pu, Hsinchu, TW;
Ya-Wen Lin, Hsinchu, TW;
Pei-Yu Li, Hsinchu, TW;
Hsiao-Pei Chiu, Hsinchu, TW;
Yenrich Technology Corporation, Hsinchu, TW;
Epistar Corporation, Hsinchu, TW;
Abstract
A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base material.