The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Feb. 07, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seungmin Cha, Suwon-si, KR;

Seungmin Song, Suwon-si, KR;

Youngwoo Kim, Suwon-si, KR;

Jinkyu Kim, Suwon-si, KR;

Sora You, Suwon-si, KR;

Namhyun Lee, Suwon-si, KR;

Sungmoon Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/535 (2006.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 64/01 (2025.01); H10D 64/27 (2025.01); H10D 84/83 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 23/535 (2013.01); H10D 30/024 (2025.01); H10D 30/62 (2025.01); H10D 64/017 (2025.01); H10D 64/513 (2025.01); H10D 84/834 (2025.01); H10D 84/853 (2025.01);
Abstract

An integrated circuit device includes a substrate, having a front surface and a rear surface opposite to each other, and a fin-type active region defined by a trench in the front surface, a device separation layer filling the trench, a source/drain region on the fin-type active region, a first conductive plug arranged on the source/drain region and electrically connected to the source/drain region, a power wiring line at least partially arranged on a lower surface of the substrate, a buried rail connected to the power wiring line through the device separation layer and decreasing in horizontal width toward the power wiring line, and a power via connecting the buried rail to the first conductive plug.


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