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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12557667 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Feb. 16, 2023

Semiconductor device with lead frame having an offset portion on a die pad

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Toshiyuki Hata, Tokyo, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

Rimon P.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 23/49816 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 2224/08055 (2013.01); H01L 2224/08113 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/4814 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/4903 (2013.01); H01L 2924/182 (2013.01);
Abstract

A package construction includes: a die pad, and a suspension lead remaining portion connected to the die pad. Here, an offset portion is provided from a peripheral edge portion of the die pad to the suspension lead remaining portion. Also, the suspension lead remaining portion has: a first end portion connected to the die pad, and a second end portion opposite the first end portion. Further, the second end portion of the suspension lead remaining portion is exposed from the side surface of the sealing body at a position spaced apart from each of the upper surface and the lower surface.

Find Patent Forward Citations

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Hata, Toshiyuki. (2026). Semiconductor device with lead frame having an offset portion on a die pad (U.S. Patent No. 12557667). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12557667

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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