The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Apr. 24, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes: a first semiconductor chip on a first package substrate; a second semiconductor chip on a second package substrate; an interposer between the first semiconductor chip and the second package substrate; and a heat dissipation layer on the interposer, wherein the first and second semiconductor chips are spaced apart from each other horizontally and do not overlap in a vertical direction, and wherein a first portion of the heat dissipation layer at least partially overlapping the first semiconductor chip in the vertical direction and a second portion of the heat dissipation layer at least partially overlapping the second semiconductor chip in the vertical direction are spaced apart from each other, and the first portion is positioned around an outer boundary of the second portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile