The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Feb. 04, 2022
Rohm Co., Ltd., Kyoto, JP;
Yuji Koga, Kyoto, JP;
ROHM Co., LTD., Kyoto, JP;
Abstract
Provided is a semiconductor element including a semiconductor substrate; a semiconductor layer laminated to the semiconductor substrate, and having a circuit formed within the semiconductor layer; a conductive layer disposed on an opposite side of the semiconductor layer from the semiconductor substrate and including a part electrically connected to the circuit; and a conductive portion disposed between the semiconductor layer and the conductive layer, and electrically connected to the conductive layer. The conductive layer includes a check pattern not electrically connected to the circuit, and the conductive portion includes a superimposition portion superimposed on the check pattern as viewed in a thickness direction of the semiconductor substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile