The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jan. 20, 2023
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Jae-Man Lee, Anyang-si, KR;

Hoon Kim, Asan-si, KR;

Hwiseong Kim, Seongnam-si, KR;

Donghoo Kim, Cheonan-si, KR;

Sunyoung Kim, Cheonan-si, KR;

Hee-Won Yoon, Asan-si, KR;

Seungwon Lee, Cheonan-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/65 (2023.01); H10K 59/122 (2023.01); H10K 59/40 (2023.01); H10K 59/80 (2023.01); H10K 50/80 (2023.01); H10K 50/842 (2023.01); H10K 50/844 (2023.01); H10K 59/12 (2023.01); H10K 59/124 (2023.01);
U.S. Cl.
CPC ...
H10K 59/65 (2023.02); H10K 59/122 (2023.02); H10K 59/40 (2023.02); H10K 59/873 (2023.02); H10K 50/8426 (2023.02); H10K 50/844 (2023.02); H10K 50/868 (2023.02); H10K 59/12 (2023.02); H10K 59/124 (2023.02); H10K 59/8792 (2023.02);
Abstract

A display device includes a signal transmission region, a display region spaced apart from the signal transmission region, a peripheral region located between the signal transmission region and the display region, a base layer, a circuit layer disposed on the base layer, a light emitting element layer disposed on the circuit layer and that includes a light emitting element that overlaps the display region, an encapsulation substrate disposed on the light emitting element layer, a hole defined in the signal transmission region and that passes through at least a portion of each of the circuit layer and the light emitting element layer, and a groove pattern defined on one surface of the encapsulation substrate and that overlaps the peripheral region.


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