The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Dec. 06, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kiyun Jo, Suwon-si, KR;

Jongjun Kim, Suwon-si, KR;

Heeyun Chung, Suwon-si, KR;

Kihuk Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/52 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01);
U.S. Cl.
CPC ...
H04N 23/52 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01);
Abstract

A camera module according to an embodiment may comprise: a printed circuit board including a first opening; a housing assembly comprising a housing arranged on a first surface of the printed circuit board; a first rear member comprising a plate arranged on a second surface of the printed circuit board, and arranged to overlap with the first opening and a part of the printed circuit board; a second rear member comprising a support arranged on the second surface of the printed circuit board and including a second opening in which the first rear member is arranged, and has a thickness thicker than a thickness of the first rear member; an image sensor arranged on one surface of the first rear member and exposed toward the housing assembly through the first opening; and at least one lens aligned to have the same optical axis of the image sensor, and arranged in the inner space of the housing assembly.


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