The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

May. 02, 2025
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Stephen D. Panshin, Corvallis, OR (US);

Paul S. Everest, Corvallis, OR (US);

Michael Harmon, Vancouver, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 9/40 (2022.01); B41J 2/175 (2006.01); G06F 21/64 (2013.01); H04L 9/32 (2006.01);
U.S. Cl.
CPC ...
H04L 9/3247 (2013.01); B41J 2/17546 (2013.01); G06F 21/64 (2013.01);
Abstract

A logic circuitry package includes an interface to communicate with a controller and a logic circuit. The logic circuit includes a memory arrangement storing indicated data over which a manufacturing digital signature is computed, a certificate for the controller to verify the manufacturing digital signature, and manufacturing attribute data. The manufacturing attribute data includes at least one indication indicating the indicated data and the manufacturing digital signature. The logic circuit is configured to transmit, to the controller, the manufacturing attribute data in response to at least one first request from the controller. The logic circuit is configured to transmit, to the controller, the certificate and the indicated data in response to at least one second request from the controller.


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