The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jul. 31, 2023
Applicant:

Sandisk Technologies, Inc., Milpitas, CA (US);

Inventors:

Shiqiang Sun, Shenzhen, CN;

Lihwa Fong, Irvine, CA (US);

Ning Ye, San Jose, CA (US);

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/627 (2006.01); H01G 2/06 (2006.01); H01G 9/02 (2006.01); H01G 9/08 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6273 (2013.01); H01G 2/065 (2013.01); H01G 9/02 (2013.01); H01G 9/08 (2013.01);
Abstract

A snap fit bracket for an electrolytic capacitor is vertically mounted within an opening defined by a substrate. The bracket includes four sidewalls that form a perimeter. A first flange extends from one sidewall and forms a first ledge that sits on a top surface of the substrate when the bracket is mounted within the opening defined by the substrate. A second flange extends from another sidewall and forms a second ledge that sits on the top surface of the substrate when the bracket is mounted within the opening defined by the substrate. A fastener extends from two or more of the sidewalls. A top surface of each fastener contacts a bottom surface of the substrate when the bracket is mounted within the opening defined by the substrate. After vertically mounting the bracket within the substrate, the capacitor disposed within the bracket is horizontally mounted with respect to the PCB.


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