The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Mar. 26, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Wenqin Huangfu, Goleta, CA (US);

Krishna T. Malladi, San Jose, CA (US);

Dongyan Jiang, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 12/14 (2006.01); G06F 9/50 (2006.01); G06F 13/16 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 12/1433 (2013.01); G06F 9/5016 (2013.01); G06F 13/1673 (2013.01); G06F 13/4234 (2013.01); G06F 2209/508 (2013.01);
Abstract

A memory module may include one or more memory devices, and a near-memory computing module coupled to the one or more memory devices, the near-memory computing module including one or more processing elements configured to process data from the one or more memory devices, and a memory controller configured to coordinate access of the one or more memory devices from a host and the one or more processing elements. A method of processing a dataset may include distributing a first portion of the dataset to a first memory module, distributing a second portion of the dataset to a second memory module, constructing a first local data structure at the first memory module based on the first portion of the dataset, constructing a second local data structure at the second memory module based on the second portion of the dataset, and merging the first and second local data structures.


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