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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12554194 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Mar. 29, 2022

Conductive substrate comprising a conductive thin wire containing a metal and method of making thereof

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Aya Nakayama, Kanagawa, JP;

Katsuyuki Nukui, Kanagawa, JP;

Yuya Motomura, Kanagawa, JP;

Toru Ogawa, Kanagawa, JP;

Shinichi Nakahira, Kanagawa, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorneys:

Edwards Neils LLC

Jean C. Edwards, Esq.

Primary Examiner:

Hoa (Holly) Le

Int. Cl.
CPC ...
B32B 7/025 (2019.01); G03F 7/004 (2006.01); G03F 7/32 (2006.01); G06F 3/044 (2006.01); H01B 1/02 (2006.01); H01B 3/42 (2006.01); H01B 5/14 (2006.01); H01B 19/04 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0042 (2013.01); G03F 7/327 (2013.01); G06F 3/044 (2013.01); H01B 1/02 (2013.01); H01B 3/427 (2013.01); H01B 5/14 (2013.01); H01B 19/04 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01);
Abstract

A manufacturing method for a conductive substrate, with which a conductive substrate including a substrate and a conductive thin wire arranged on the substrate are manufactured, includes in the following order, a step 1 of forming a thin wire containing a metal on the substrate; a step 2 of bringing the thin wire into contact with a solution containing an organic acid; and a step 3 of subjecting the thin wire to a plating treatment to form a conductive thin wire.

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Nakayama, Aya. (2026). Conductive substrate comprising a conductive thin wire containing a metal and method of making thereof (U.S. Patent No. 12554194). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12554194

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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