The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Oct. 18, 2021
Applicant:

Stmicroelectronics France, Montrouge, FR;

Inventors:

Matthieu Nongaillard, Grenoble, FR;

Thomas Oheix, Grenoble, FR;

Assignee:

STMicroelectronics France, Montrouge, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 1/38 (2012.01); G03F 7/00 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
G03F 1/38 (2013.01); G03F 7/70683 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01);
Abstract

The invention concerns a method of manufacturing an assembly of electronic components on a front surface of a semiconductor substrate comprising a plurality of field areas, each field area comprising at least one field and each field comprising at least one electronic component, the method comprising a plurality of photolithography steps to form a stack of layers forming each electronic component, each photolithography step defining a mask level and comprising the application of a mask successively on each field in photolithography equipment, the positioning of said mask on each field being performed relative to a reference mask level, one of the masks being designated as identification mask. The manufacturing method is remarkable in that:


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