The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jan. 27, 2022
Applicant:

The Regents of the University of Colorado, a Body Corporate, Boulder, CO (US);

Inventors:

Yongkun Sui, Danbury, CT (US);

Madhur Bharath Atreya, Louisville, CO (US);

Gregory Lewis Whiting, Boulder, CO (US);

Jenna Nielson, Longmont, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/22 (2006.01); G01N 33/24 (2006.01);
U.S. Cl.
CPC ...
G01N 27/223 (2013.01); G01N 33/246 (2013.01);
Abstract

A capacitive soil moisture sensor for detecting moisture levels in soil comprises a biodegradable substrate. A capacitive circuit is positioned on the biodegradable substrate. An antenna circuit is configured to communicate capacitance data. A hydrophobic, biodegradable encapsulating material encases at least the capacitive circuit.


Find Patent Forward Citations

Sui, Yongkun. (2026). Additively fabricated capacitive soil moisture sensor (U.S. Patent No. 12553847). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12553847

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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